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Wago-2060-1852/998-404
THR PCB klemensi

THR PCB klemensi; basma buton; 0,75 mm²; Pin aralığı 8 mm; 2 kutuplu; Push-in CAGE CLAMP®; bant ve makara (tape-and-reel) pakette; 0,75 mm²; beyaz THR PCB terminal blocks with push-buttons and Push-in CAGE CLAMP® connectionPush-in termination of solid and ferruled conductorsConvenient termination/removal of fine-stranded conductors via push-buttonsJust 4.5 mm tallAvailable in tape-and-reel packaging for automated assemblyAlso suitable for wave solderingNote:Application note:Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max. 260 °C peak temperature. Due to customer-specific variables (e.g., component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions.Recommendation for stencil:150 µm material thicknessThe stencil hole diameter is identical to the outer diameter of the metal-plated PCB hole.Note:Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality.Recommendation:Recommendation for stencil:150 µm material thicknessThe stencil hole diameter is identical to the outer diameter of the metal-plated PCB hole.

THR PCB klemensi; basma buton; 0,75 mm²; Pin aralığı 8 mm; 2 kutuplu; Push-in CAGE CLAMP®; bant ve makara (tape-and-reel) pakette; 0,75 mm²; beyaz


  • THR PCB terminal blocks with push-buttons and Push-in CAGE CLAMP® connection
  • Push-in termination of solid and ferruled conductors
  • Convenient termination/removal of fine-stranded conductors via push-buttons
  • Just 4.5 mm tall
  • Available in tape-and-reel packaging for automated assembly
  • Also suitable for wave soldering

Note:



Application note:

Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max.
260 °C peak temperature. Due to customer-specific variables (e.g., component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions.

Recommendation for stencil:

150 µm material thickness
The stencil hole diameter is identical to the outer diameter of the metal-plated PCB hole.


Note:


Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality.


Recommendation:


Recommendation for stencil:

150 µm material thickness
The stencil hole diameter is identical to the outer diameter of the metal-plated PCB hole.

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