SMD PCB klemens; 0,5 mm²; Pin aralığı 3 mm; 1 kutuplu; PUSH WIRE®; bant ve makara (tape-and-reel) pakette; 0,50 mm²; siyah PUSH WIRE® bağlantı teknolojili SMD klemenslerTek damarlı kabloları bastırarak sonlandırmaKolay iletken çıkarma, örneğin el aleti yardımıylaSadece 2,7 mm yükseklikHiçbir kutbu kaybetmeden grup halinde düzenleme mümkündürOtomatik montaj için bant ve makara (tape-and-reel) paketlemeli olarak temin edilebilirNote:Application note:Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max. 260 °C peak temperature. Due to customer-specific variables (e.g., component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions.Note:Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality.Recommendation:Recommendation for SMD stencil:Material thickness, 150 µm. Pattern layout identical to solder pad layout.
SMD PCB klemens; 0,5 mm²; Pin aralığı 3 mm; 1 kutuplu; PUSH WIRE®; bant ve makara (tape-and-reel) pakette; 0,50 mm²; siyah
Application note:
Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max.
260 °C peak temperature. Due to customer-specific variables (e.g., component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions.
Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality.
Recommendation for SMD stencil:
Material thickness, 150 µm. Pattern layout identical to solder pad layout.
Tüm hakları saklıdır. Mnelko Endüstriyel San. ve Tic.Ltd.Şti. 2024
