Communication module for XC100/200, 24 V DC, serial, modbus, SUCOM-A, DNP3Modular programmable controllers XC100 and XC200 offer an outstanding level of scalability. Different CPU performance classes and a wide range of expansion modules (XIOC-Module) are available. The compact modular PLCs XC152 facilitate cost-effective solutions of automation tasks using their computing power, the SmartWire-DT interface as well as a whole range of further interfaces. a particular feature is the ability to integrate the product into modern communication concepts. Data exchange via the Ethernet interface to OPC clients or the integrated WEB servers enables the creation of innovative solutions.
Communication module for XC100/200, 24 V DC, serial, modbus, SUCOM-A, DNP3
Modular programmable controllers XC100 and XC200 offer an outstanding level of scalability. Different CPU performance classes and a wide range of expansion modules (XIOC-Module) are available. The compact modular PLCs XC152 facilitate cost-effective solutions of automation tasks using their computing power, the SmartWire-DT interface as well as a whole range of further interfaces. a particular feature is the ability to integrate the product into modern communication concepts. Data exchange via the Ethernet interface to OPC clients or the integrated WEB servers enables the creation of innovative solutions.
Function | Communication modules |
Description | Compact I/O system for connection to XC100/200 Modular PLCs XC100/200 expandable with up to 15 XI/OC modules Optionally, screw terminals or spring-loaded terminals for digital/analog modules |
Standards | Serial interface RS232C, RS485, RS422 Modes of operation: Transparent mode MODBUS Master/Slave SUCOM-A DNP3-Protocol |
Ambient temperature | |
Storage [ϑ] | IEC/EN 61131-2 EN 50178 |
Vibration resistance | 0 - +55 °C |
Mechanical shock resistance | -20 - +70 °C |
Impact resistance | 10 - 57 Hz ±0.075 mm 57 - 150 Hz ±1.0 mm |
Overvoltage category/pollution degree | 15 Shock duration 11 ms g |
Protection class | 500 g/⌀ 50 mm ±25 g |
Degree of Protection | II/2 |
Emitted interference | 1 |
Weight | IP20 |
Rated voltage [Ue ] | DIN/EN 55011/22, Class A |
Admissible range | 0.2 kg |
Residual ripple | |
Neutral poles >Duration of dip |
24 (12) V DC |
Neutral poles >Repetition rate |
20.4 – 28.8 (11.8 – 14.4) |
Maximum power loss [Pv] | ≦ 5 % |
Built-in interfaces | 10 ms |
Protocol | 1 s |
Character formats | 6.6 W |
Control and signal cables | |
Data transfer rate | RS232(C), RS422, RS485 |
Potential isolation | Tranparent mode, Modbus Master/Slave, SUCOM-A, DNP3 protocol |
Transmit/receive data | 8E1, 8O1, 8N1, 8N2, 7E2, 7O2, 7N2, 7E1 |
Bus terminating resistors | RTS, CTS, DTR, DSR, DCD |
Plug arrangement | 0.3 …57.6 kBit/s |
Current consumption [Ie] | Yes (RS485, RS422) |
Number of modules | 250/500 |
Slots | Switchable for RS485, RS422 |
Operating mode Transparent mode >Data transfer rate |
RS232: 9 pole SUB-D plug RS485, 422: plug terminal block |
Operating mode Transparent mode >Character formats |
275 mA |
Operating mode >Transmit/receive data |
XC200: 4 |
Rated operational current for specified heat dissipation [In] | As required |
Heat dissipation per pole, current-dependent [Pvid] | |
Equipment heat dissipation, current-dependent [Pvid] | 0.3 …57.6 kBit/s |
Static heat dissipation, non-current-dependent [Pvs] | 8E1, 8O1, 8N1, 8N2, 7E2, 7O2, 7N2, 7E1 |
Heat dissipation capacity [Pdiss] | 250/500 |
Operating ambient temperature min. | |
Operating ambient temperature max. | 0 A |
10.2 Strength of materials and parts >10.2.2 Corrosion resistance |
0 W |
10.2 Strength of materials and parts >10.2.3.1 Verification of thermal stability of enclosures |
0 W |
10.2 Strength of materials and parts >10.2.3.2 Verification of resistance of insulating materials to normal heat |
6.6 W |
10.2 Strength of materials and parts >10.2.3.3 Verification of resistance of insulating materials to abnormal heat and fire due to internal electric effects |
0 W |
10.2 Strength of materials and parts >10.2.4 Resistance to ultra-violet (UV) radiation |
0 °C |
10.2 Strength of materials and parts >10.2.5 Lifting |
+55 °C |
10.2 Strength of materials and parts >10.2.6 Mechanical impact |
|
10.2 Strength of materials and parts >10.2.7 Inscriptions |
Meets the product standard´s requirements. |
10.3 Degree of protection of ASSEMBLIES | Meets the product standard´s requirements. |
10.4 Clearances and creepage distances | Meets the product standard´s requirements. |
10.5 Protection against electric shock | Meets the product standard´s requirements. |
10.6 Incorporation of switching devices and components | Meets the product standard´s requirements. |
10.7 Internal electrical circuits and connections | Does not apply, since the entire switchgear needs to be evaluated. |
10.8 Connections for external conductors | Does not apply, since the entire switchgear needs to be evaluated. |
10.9 Insulation properties >10.9.2 Power-frequency electric strength |
Meets the product standard´s requirements. |
10.9 Insulation properties >10.9.3 Impulse withstand voltage |
Meets the product standard´s requirements. |
10.9 Insulation properties >10.9.4 Testing of enclosures made of insulating material |
Meets the product standard´s requirements. |
10.10 Temperature rise | Does not apply, since the entire switchgear needs to be evaluated. |
10.11 Short-circuit rating | Does not apply, since the entire switchgear needs to be evaluated. |
10.12 Electromagnetic compatibility | Is the panel builder´s responsibility. |
10.13 Mechanical function | Is the panel builder´s responsibility. |
Number of HW-interfaces industrial Ethernet | Is the panel builder´s responsibility. |
Number of interfaces PROFINET | Is the panel builder´s responsibility. |
Number of HW-interfaces RS-232 | Is the panel builder´s responsibility. |
Number of HW-interfaces RS-422 | The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices. |
Number of HW-interfaces RS-485 | Is the panel builder´s responsibility. |
Number of HW-interfaces serial TTY | Is the panel builder´s responsibility. |
Number of HW-interfaces USB | The device meets the requirements, provided the information in the instruction leaflet (IL) is observed. |
Number of HW-interfaces parallel | |
Number of HW-interfaces Wireless | |
Number of HW-interfaces other | 0 |
With optical interface | 0 |
Supporting protocol for TCP/IP | 1 |
Supporting protocol for PROFIBUS | 1 |
Supporting protocol for CAN | 1 |
Supporting protocol for INTERBUS | 0 |
Supporting protocol for ASI | 0 |
Supporting protocol for KNX | 0 |
Supporting protocol for MODBUS | 0 |
Supporting protocol for Data-Highway | 0 |
Supporting protocol for DeviceNet | No |
Supporting protocol for SUCONET | No |
Supporting protocol for LON | No |
Supporting protocol for PROFINET IO | No |
Supporting protocol for PROFINET CBA | No |
Supporting protocol for SERCOS | No |
Supporting protocol for Foundation Fieldbus | No |
Supporting protocol for EtherNet/IP | Yes |
Supporting protocol for AS-Interface Safety at Work | No |
Supporting protocol for DeviceNet Safety | No |
Supporting protocol for INTERBUS-Safety | No |
Supporting protocol for PROFIsafe | No |
Supporting protocol for SafetyBUS p | No |
Supporting protocol for other bus systems | No |
Radio standard Bluetooth | No |
Radio standard WLAN 802.11 | No |
Radio standard GPRS | No |
Radio standard GSM | No |
Radio standard UMTS | No |
IO link master | No |
Redundancy | No |
Type of data transmission | No |
Transmission rate | Yes |
With potential separation | No |
Category according to EN 954-1 | No |
SIL according to IEC 61508 | No |
Suitable for safety functions | No |
Performance level acc. EN ISO 13849-1 | No |
Appendant operation agent (Ex ia) | No |
Appendant operation agent (Ex ib) | No |
Explosion safety category for gas | Serial |
Explosion safety category for dust | 57.6 kBit/s |
Width | No |
Height | |
Depth | None |
North America Certification | No |
Specially designed for North America | None |
Current Limiting Circuit-Breaker | No |
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