Compact flash memory card for XP500Compact flash memory card, minimum memory capacity 4GB, CFAST technology
Compact flash memory card for XP500
Compact flash memory card, minimum memory capacity 4GB, CFAST technology
| Product range | Visualisation solutions XP |
| Product range | XP-503 |
| For use with | XP-503 |
| Note on heat dissipation | |
| Temperature >Operating ambient temperature min. |
not relevant |
| Temperature >Operating ambient temperature max. |
|
| Operating ambient temperature min. | 0 °C |
| Operating ambient temperature max. | +50 °C |
| 10.2 Strength of materials and parts >10.2.2 Corrosion resistance |
|
| 10.2 Strength of materials and parts >10.2.3.1 Verification of thermal stability of enclosures |
0 °C |
| 10.2 Strength of materials and parts >10.2.3.2 Verification of resistance of insulating materials to normal heat |
+50 °C |
| 10.2 Strength of materials and parts >10.2.3.3 Verification of resistance of insulating materials to abnormal heat and fire due to internal electric effects |
|
| 10.2 Strength of materials and parts >10.2.4 Resistance to ultra-violet (UV) radiation |
Meets the product standard´s requirements. |
| 10.2 Strength of materials and parts >10.2.5 Lifting |
Meets the product standard´s requirements. |
| 10.2 Strength of materials and parts >10.2.6 Mechanical impact |
Meets the product standard´s requirements. |
| 10.2 Strength of materials and parts >10.2.7 Inscriptions |
Meets the product standard´s requirements. |
| 10.3 Degree of protection of ASSEMBLIES | Meets the product standard´s requirements. |
| 10.4 Clearances and creepage distances | Does not apply, since the entire switchgear needs to be evaluated. |
| 10.5 Protection against electric shock | Does not apply, since the entire switchgear needs to be evaluated. |
| 10.6 Incorporation of switching devices and components | Meets the product standard´s requirements. |
| 10.7 Internal electrical circuits and connections | Meets the product standard´s requirements. |
| 10.8 Connections for external conductors | Meets the product standard´s requirements. |
| 10.9 Insulation properties >10.9.2 Power-frequency electric strength |
Does not apply, since the entire switchgear needs to be evaluated. |
| 10.9 Insulation properties >10.9.3 Impulse withstand voltage |
Does not apply, since the entire switchgear needs to be evaluated. |
| 10.9 Insulation properties >10.9.4 Testing of enclosures made of insulating material |
Is the panel builder´s responsibility. |
| 10.10 Temperature rise | Is the panel builder´s responsibility. |
| 10.11 Short-circuit rating | Is the panel builder´s responsibility. |
| 10.12 Electromagnetic compatibility | Is the panel builder´s responsibility. |
| 10.13 Mechanical function | Is the panel builder´s responsibility. |
| Type of memory | The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices. |
| Memory size | Is the panel builder´s responsibility. |
| North America Certification | Is the panel builder´s responsibility. |
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