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Wago-2061-622/998-404
SMD PCB terminal

SMD PCB klemens; basma buton; 1,5 mm²; Pin aralığı 6 mm; 2 kutuplu; Push-in CAGE CLAMP®; bant ve makara (tape-and-reel) pakette; 1,50 mm²; siyah SMD PCB terminal blocks with Push-in CAGE CLAMP® connection and push-buttonsJust 5.6 mm tallPush-in termination of solid and ferruled conductorsPush-buttons simplify insertion/removal of all conductor typesAvailable in tape-and-reel packaging for automated assemblyNote:Application notes:Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max. 260°C peak temperature. Due to customer-specific variables (e.g., component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions.Note:Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality.Recommendation:Recommendation for SMD stencil:Material thickness, 150 µm. Pattern layout identical to solder pad layout.

SMD PCB klemens; basma buton; 1,5 mm²; Pin aralığı 6 mm; 2 kutuplu; Push-in CAGE CLAMP®; bant ve makara (tape-and-reel) pakette; 1,50 mm²; siyah


  • SMD PCB terminal blocks with Push-in CAGE CLAMP® connection and push-buttons
  • Just 5.6 mm tall
  • Push-in termination of solid and ferruled conductors
  • Push-buttons simplify insertion/removal of all conductor types
  • Available in tape-and-reel packaging for automated assembly

Note:


Application notes:

Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max. 260°C peak temperature. Due to customer-specific variables (e.g., component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions.


Note:


Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality.


Recommendation:


Recommendation for SMD stencil:

Material thickness, 150 µm. Pattern layout identical to solder pad layout.

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