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Wago-2060-872/998-404
SMD PCB terminal

SMD PCB klemens; basma buton; 0,75 mm²; Pin aralığı 8 mm; 2 kutuplu; Push-in CAGE CLAMP®; bant ve makara (tape-and-reel) pakette; 0,75 mm²; siyah SMD PCB terminal blocks with Push-in CAGE CLAMP® connection technology and push-buttons8 mm pin spacing version for higher-rated voltagesPush-in termination of solid and ferruled conductorsConvenient termination/removal of fine-stranded conductors via push-buttonsHeight of just 4.5 mm minimizes on-board LED shadowingAvailable in tape-and-reel packaging for automated assemblyNote:Application note:Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max. 260 °C peak temperature. Due to customer-specific variables (e.g., component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions.Note:Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality.Recommendation:Recommendation for SMD stencil:Material thickness, 150 µm. Pattern layout identical to solder pad layout.

SMD PCB klemens; basma buton; 0,75 mm²; Pin aralığı 8 mm; 2 kutuplu; Push-in CAGE CLAMP®; bant ve makara (tape-and-reel) pakette; 0,75 mm²; siyah


  • SMD PCB terminal blocks with Push-in CAGE CLAMP® connection technology and push-buttons
  • 8 mm pin spacing version for higher-rated voltages
  • Push-in termination of solid and ferruled conductors
  • Convenient termination/removal of fine-stranded conductors via push-buttons
  • Height of just 4.5 mm minimizes on-board LED shadowing
  • Available in tape-and-reel packaging for automated assembly

Note:



Application note:

Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max.
260 °C peak temperature. Due to customer-specific variables (e.g., component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions.


Note:


Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality.


Recommendation:


Recommendation for SMD stencil:

Material thickness, 150 µm. Pattern layout identical to solder pad layout.

As Mnelko, we are a reliable partner in industrial automation solutions, offering high-quality and innovative products with a wide product range to meet all the needs of your business. Our product portfolio consists of solutions designed based on the principles of high performance, durability, and efficiency to support modern industrial processes.
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