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2059-322/998-403
SMD PCB terminal

SMD PCB terminal block; 0.5mm²; Pin pitch 3 mm; 2 poles; PUSH WIRE®; tape and reel (tape-and-reel) in the package; 0.50mm²; blackSMD terminal blocks with PUSH WIRE ® connection technology Press-in termination of single-core cables Easy conductor removal, e.g. using a hand tool Only 2.7mm height Group arrangement possible without losing any poles Available in tape-and-reel packaging for automatic assembly Note:Application note: Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max. 260 °C peak temperature. Due to customer-specific variables (eg, component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions. Note:Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality. Recommendation:Recommendation for SMD stencil: Material thickness, 150 µm. Pattern layout identical to solder pad layout.

SMD PCB terminal block; 0.5mm²; Pin pitch 3 mm; 2 poles; PUSH WIRE®; tape and reel (tape-and-reel) in the package; 0.50mm²; black


  • SMD terminal blocks with PUSH WIRE ® connection technology
  • Press-in termination of single-core cables
  • Easy conductor removal, e.g. using a hand tool
  • Only 2.7mm height
  • Group arrangement possible without losing any poles
  • Available in tape-and-reel packaging for automatic assembly

Note:



Application note:

Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max.
260 °C peak temperature. Due to customer-specific variables (eg, component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions.


Note:


Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality.


Recommendation:


Recommendation for SMD stencil:

Material thickness, 150 µm. Pattern layout identical to solder pad layout.

Anma gerilimi (III / 3) 63V
Şok gerilimi (3) 2,5kV
Anma gerilimi (III / 2) 160V
Şok gerilimi (1) 2,5kV
Anma gerilimi (II / 2) 320V
Şok gerilimi(2) 2,5kV
Nominal akım 3A
Legend (ratings) (III / 2) ≙ Overvoltage category III / Pollution degree 2
Rated voltage per UL 1977 (factory wiring only) 250V
Rated current per UL 1977 (factory wiring only) 3A
Bağlantı teknolojisi PUSH WIRE®
Actuation type Operating tool
Tek damarlı boylar 0,14 … 0,34 mm² / 26 … 22 AWG
Sıyırma uzunluğu 4 … 5,5 mm / 0.16 … 0.22 inch
PCB´ye iletken giriş açısı 0°
Kutup sayısı 2
tek damarlı, bağlanabilir 0,5 mm² / 20 AWG
Not (iletken kesiti) 2 No reconnection of smaller conductor cross-sections (0.5 mm² / 20 AWG)
Sıyırma uzunluğu 6 … 7,5 mm / 0.24 … 0.3 inch
Toplam bağlantı noktası sayısı 2
Toplam potansiyel sayısı 2
Üründeki münferit bağlantı nesnesi sayısı 1
Seviye sayısı 1
Not (iletken kesiti) For conductors that are not rigid enough (26 AWG), the clamping unit must be opened using an operating tool.
Pin aralığı 3 mm / 0.118 inch
Width 5,9 mm / 0.232 inch
Height 2,7 mm / 0.106 inch
Depth 7,9 mm / 0.311 inch
Reel diameter of tape-and-reel packaging 330mm
Tape width 16mm
PCB contact SMD
Renk siyah
Malzeme grubu I
İzolasyon malzemesi Polyphthalamide (PPA GF)
UL 94´e göre tutuşabilirlik değeri V0
Sıkıştırma yayı malzemesi Chrome nickel spring steel (CrNi)
Kontak materyali Copper alloy
Kontak kaplaması kalay kaplamalı
Ağırlık 0,2
Sınır sıcaklık aralığı -60 … +105 °C
SAP´den ambalaj tipi BOX
Country of origin CH
GTIN 4055143476560
Customs Tariff No. 85369010000

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